The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Oct. 23, 2019
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Takahiro Shimohata, Shiojiri, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2251 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An endoscope includes an image pickup apparatus disposed in a rigid distal end portion. The image pickup apparatus is provided with: an image pickup sensor with an external electrode being disposed on a rear face; a signal cable, a distal end portion of which is bonded to the external electrode of the imager; and resin sealing a bonding junction between the external electrode and the distal end portion, where the resin is accommodated in a space formed when the rear face is projected in a direction of an optical axis of the imager. A rear end position of the resin is defined by a resin stopping portion of the signal cable.


Find Patent Forward Citations

Shimohata, Takahiro. (2021). Image pickup module and endoscope including image pickup module in which bonding junction between image pickup portion and signal cable is resin-sealed by curable resin (U.S. Patent No. 10924640). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10924640

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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