The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Aug. 02, 2018
Applicant:

Inphi Corporation, Santa Clara, CA (US);

Inventors:

Liang Ding, Singapore, SG;

Radhakrishnan L. Nagarajan, Santa Clara, CA (US);

Roberto Coccioli, Westlake Village, CA (US);

Assignee:

INPHI CORPORATION, San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 9/08 (2006.01); H04B 10/70 (2013.01); H05K 1/02 (2006.01); G02B 6/12 (2006.01); G06Q 20/06 (2012.01);
U.S. Cl.
CPC ...
H04L 9/0858 (2013.01); G02B 6/12 (2013.01); G06Q 20/065 (2013.01); H04B 10/70 (2013.01); H05K 1/0274 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12123 (2013.01); H04L 2209/56 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A compact optical transceiver formed by hybrid multichip integration. The optical transceiver includes a Si-photonics chip attached on a PCB. Additionally, the optical transceiver includes a first TSV interposer and a second TSV interposer separately attached nearby the Si-photonics chip on the PCB. Furthermore, the optical transceiver includes a driver chip flip-bonded partially on the Si-photonics chip through a first sets of bumps and partially on the first TSV interposer through a second sets of bumps. Moreover, the optical transceiver includes a transimpedance amplifier module chip flip-bonded partially on the Si-photonics chip through a third sets of bumps and partially on the second TSV interposer through a fourth set of bumps.


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