logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10923650 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Sep. 04, 2018

Magneto-resistive chip package including shielding structure

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae-gwon Jang, Hwaseong-si, KR;

Baik-woo Lee, Gwangmyeong-si, KR;

Young-jae Kim, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Sophia T Nguyen

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/10 (2006.01); H01L 23/14 (2006.01); H01L 23/049 (2006.01); H01L 23/051 (2006.01); H01L 43/08 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/055 (2006.01); H01L 23/06 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
H01L 43/08 (2013.01); H01L 23/049 (2013.01); H01L 23/051 (2013.01); H01L 23/055 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/14 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/3142 (2013.01); H01L 23/552 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/48 (2013.01); H01L 43/12 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01);
Abstract

In one embodiment, a magneto-resistive chip package includes a circuit board; a shielding body including a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part and including a magneto-resistive cell array; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part encapsulating the magneto-resistive chip on the circuit board, and having an upper surface that is higher than an upper surface of the magneto-resistive chip; and a shielding cover positioned on the shielding intermediate part, and on the encapsulation part.

Find Patent Forward Citations

Loading…