IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10923645 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Dec. 11, 2019

Light source device having package including first electrode and second electrode and substrate including wiring members facing first electrode and second electrode

Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Takeshi Aki, Tokushima, JP;

Ryosuke Wakaki, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:

Global IP Counselors, LLP

Primary Examiner:

Duy T Nguyen

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 31/12 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 33/62 (2010.01); H01L 33/40 (2010.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/08 (2013.01); H01L 33/38 (2013.01); H01L 33/40 (2013.01); H01L 33/486 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light source device includes a package and a substrate. The package includes first and second electrodes. The first electrode has first and second parts separated from each other by a first separation region on a lower surface side of the first electrode while the first part is continuous with the second part on an upper surface side. The substrate includes a pair of wiring members. Lower surfaces of the first and second parts face and are mounted on an upper surface of one of the wiring members. A lower surface of the second electrode faces and is mounted on an upper surface of the other of the wiring members. A region of the substrate facing the first separation region has solder wettability lower than solder wettability of the upper surface of the one of the wiring members facing the first part and the second part of the first electrode.

Find Patent Forward Citations

Loading…