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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10923640 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Oct. 28, 2016

Optoelectronic component and method of producing same

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Thomas Schwarz, Regensburg, DE;

Stefan Listl, Pettendorf, DE;

Björn Hoxhold, Sinzing Viehhausen, DE;

Frank Singer, Regenstauf, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Sue A Purvis

Assistant Examiner:

Scott Stowe

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01); G09F 9/302 (2006.01); G09F 9/33 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/48 (2013.01); H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/483 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H01L 33/54 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01);
Abstract

An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

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