The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Aug. 10, 2017
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Seigo Mori, Kyoto, JP;

Masatoshi Aketa, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/76 (2006.01); H01L 21/322 (2006.01); H01L 21/28 (2006.01); H01L 29/78 (2006.01); H01L 29/12 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/32 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/739 (2006.01); H02M 5/293 (2006.01);
U.S. Cl.
CPC ...
H01L 29/063 (2013.01); H01L 21/02529 (2013.01); H01L 21/02573 (2013.01); H01L 21/046 (2013.01); H01L 21/0475 (2013.01); H01L 21/28 (2013.01); H01L 21/322 (2013.01); H01L 21/76 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 29/06 (2013.01); H01L 29/0623 (2013.01); H01L 29/1095 (2013.01); H01L 29/12 (2013.01); H01L 29/1608 (2013.01); H01L 29/32 (2013.01); H01L 29/407 (2013.01); H01L 29/66068 (2013.01); H01L 29/78 (2013.01); H01L 29/7806 (2013.01); H01L 29/7811 (2013.01); H01L 29/16 (2013.01); H01L 29/2003 (2013.01); H01L 29/7395 (2013.01); H02M 5/293 (2013.01);
Abstract

There is provided a reverse-blocking semiconductor device that has a simple configuration, that is capable of improving a yield in a manufacturing process, and that secures a reverse withstand voltage by using a Schottky junction, and there is provided a method for manufacturing the reverse-blocking semiconductor device. A semiconductor device is provided that includes a first conductivity type semiconductor layer that has a front surface, a rear surface on an opposite side of the front surface, and an end surface, a MIS transistor structure formed at a front-surface portion of the semiconductor layer, a first electrode that forms a Schottky junction with a part of the semiconductor layer in the rear surface of the semiconductor layer, and an electric-field relaxation region that is formed to reach the rear surface from the front surface of the semiconductor layer in a peripheral region surrounding an active region in which the MIS transistor structure is formed and that is either a high-resistance region having higher resistance than the semiconductor layer or a second conductivity type impurity region.


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