The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jun. 22, 2017
Applicant:

Aledia, Grenoble, FR;

Inventors:

Tiphaine Dupont, Grenoble, FR;

Sylvia Scaringella, Eybens, FR;

Erwan Dornel, Fontaine, FR;

Philippe Gibert, Saint-Etienne-de-Crossey, FR;

Philippe Gilet, Teche, FR;

Xavier Hugon, Teche, FR;

Fabienne Goutaudier, Grenoble, FR;

Assignee:

Aledia, Echirolles, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/08 (2010.01); H01L 33/18 (2010.01); H01L 33/24 (2010.01); H01L 33/38 (2010.01); H01L 33/42 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/08 (2013.01); H01L 33/18 (2013.01); H01L 33/24 (2013.01); H01L 33/385 (2013.01); H01L 33/42 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/50 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01);
Abstract

An optoelectronic device including a substrate including first and second opposite surfaces and lateral electrical insulation elements extending in the substrate and delimiting first electrically-insulated semiconductor or conductive portions. The optoelectronic device includes, for each first portion, an assembly of light-emitting diodes electrically coupled to the first portion. The optoelectronic device includes an electrode layer covering all the light-emitting diodes, a protection layer covering the electrode layer, and walls extending in the protection layer and delimiting second portions surrounding or opposite the assemblies of light-emitting diodes. The walls contain at least one material from the group including air, a metal, a semiconductor material, a metal alloy, a partially transparent material, and a core made of an at least partially transparent material covered with an opaque or reflective layer.


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