The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Apr. 30, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Renquan Gu, Beijing, CN;

Qi Yao, Beijing, CN;

Wusheng Li, Beijing, CN;

Dongsheng Li, Beijing, CN;

Huili Wu, Beijing, CN;

Shipei Li, Beijing, CN;

Dongsheng Yin, Beijing, CN;

Fang He, Beijing, CN;

Yang Yue, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 33/38 (2010.01); H01L 23/482 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 23/481 (2013.01); H01L 23/482 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01L 27/1262 (2013.01); H01L 33/382 (2013.01); H01L 33/387 (2013.01);
Abstract

The disclosure relates to an array substrate and a manufacturing method therefor, a display panel, and a display device. The array substrate comprises a base substrate, and a lead-out line and an inorganic insulating layer which are located on one side of the base substrate; the base substrate is provided with a plurality of connection vias penetrating the base substrate and filled with a first conductive material; the inorganic insulating layer is provided with a first via and a second via, the first via penetrating to the first conductive material, and the second via penetrating to the lead-out line; a second conductive layer is disposed on the side, away from the base substrate, of the first via, the second via and the inorganic insulating layer, such that the first conductive material and the lead-out line are electrically connected through the second conductive layer.


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