The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Sep. 11, 2018
Applicant:
Samsung Display Co. Ltd., Yongin-si, KR;
Inventors:
Byoung Yong Kim, Seoul, KR;
Jeong Ho Hwang, Cheonan-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 23/00 (2006.01); G02F 1/13 (2006.01); H01L 27/32 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); G02F 1/1303 (2013.01); H01L 24/75 (2013.01); G02F 1/13452 (2013.01); H01L 24/16 (2013.01); H01L 27/3244 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.