The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Sep. 11, 2019
Applicant:

United States of America As Represented BY the Administrator of Nasa, Washington, DC (US);

Inventors:

Ari Brown, Greenbelt, MD (US);

Vilem Mikula, Washington, DC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/50 (2012.01); H01L 21/308 (2006.01); H01L 23/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/0276 (2013.01); H01L 21/32139 (2013.01); H01L 24/13 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13109 (2013.01); H01L 2924/01049 (2013.01);
Abstract

A metallic etching process includes applying an anti-reflection coating over a metallic superstrate, applying a dry film photoresist over the anti-reflection coating, removing exposed portions of the dry film photoresist exposing a portion of the anti-reflection coating, etching the exposed portions of the anti-reflection coating exposing portions of the metal superstrate, etching portions of the metallic superstrate not covered by the dry film photoresist, and removing the dry film photoresist and the anti-reflection coating leaving portions of the metallic superstrate. An indium bump liftoff process includes applying a positive photoresist, forming a liftoff mask by applying a dry film photoresist over the positive photoresist, removing exposed portions of the liftoff mask to expose a portion of a substrate, depositing an indium film over the exposed portion of the substrate and remaining portions of the liftoff mask, and removing remaining portions of the liftoff mask.


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