The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jun. 18, 2019
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Katsumi Eikyu, Tokyo, JP;

Fumihito Ota, Ibaraki, JP;

Takashi Ipposhi, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 23/562 (2013.01); H01L 2225/06544 (2013.01);
Abstract

The semiconductor device SDincludes a first wiring Mand a second wiring M The semiconductor device includes a first conductor pattern DM, a first via Vin contact with the first wiring Mand the second wiring M, and a second via DV,DV,DV,DVin contact with the first conductor pattern DM and the second wiring M In plan view, the distance between the second via DVclosest to the corner portion CI of the second wire Mand the corner portion CI is shorter than the distance between the first via Vand the corner portion CI, and the distance between the second vias adjacent to each other is shorter than the distance between the second via DVclosest to the first via Vand the first via V


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