The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jan. 17, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

In Wook Oh, Suwon-si, KR;

Dong Hyun Kim, Hwaseong-si, KR;

Doo Hwan Park, Yongin-si, KR;

Sung Keun Park, Goyang-si, KR;

Chul Hong Park, Seongnam-si, KR;

Sung Wook Hwang, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/31122 (2013.01); H01L 21/7684 (2013.01); H01L 21/76804 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76832 (2013.01); H01L 23/5226 (2013.01); H01L 21/28568 (2013.01); H01L 21/76846 (2013.01); H01L 21/76852 (2013.01); H01L 23/53238 (2013.01); H01L 23/53295 (2013.01);
Abstract

A semiconductor device includes a plurality of main contact plugs and a plurality of dummy contact plugs which pass through an insulating layer on a substrate. A plurality of upper interconnections is on the insulating layer. The plurality of dummy contact plugs include a first dummy contact plug. The plurality of upper interconnections include a first upper interconnection overlapping the first dummy contact plug. A vertical central axis of the first dummy contact plug is located outside the first upper interconnection.


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