The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jan. 24, 2017
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Sophia Huppmann, Geldersheim, DE;

Dominik Scholz, Bad Abbach, DE;

Simeon Katz, Regensburg, DE;

Assignee:

OSRAM OLED GMBH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 24/80 (2013.01); H01L 2224/80894 (2013.01);
Abstract

The invention relates to a method for producing a plurality of components (), wherein a carrier composite () is provided with a coherent base body () and a wafer composite () is provided with a coherent semiconductor body composite () and a substrate (). The wafer composite is connected to the carrier composite to form a common composite. In a subsequent method step, a plurality of separation channels () are generated at least through the base body () to form a grid structure (), which determines the dimensions of the components () to be produced. A passivation layer () is shaped in such a way that it covers the side surfaces of the separation channels (). Finally, the common composite is separated, wherein the substrate () is removed from the semiconductor body composite () and the common composite is separated along the separation channels () to form a plurality of components ().


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