The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Oct. 21, 2019
Applicant:
Richwave Technology Corp., Taipei, TW;
Inventors:
Assignee:
RichWave Technology Corp., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/477 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/477 (2013.01); H01L 23/315 (2013.01); H01L 23/488 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/13144 (2013.01);
Abstract
A method for forming a connection structure is disclosed. A semiconductor structure having a first pad and a bump respectively on a bottom surface thereof is provided. A carrier having a second pad on a top surface thereof is provided. The second pad corresponds to the bump. An epoxy portion is disposed onto the second pad of the carrier. A diameter of the epoxy portion is less than or equal to a diameter of the bump. After depositing the epoxy portion, the bump is attached to the second pad via the epoxy portion.