The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Sep. 28, 2017
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Shodai Takayoshi, Satsumasendai, JP;
Yoshio Ohashi, Satsumasendai, JP;
Takeyuki Arai, Satsumasendai, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01C 7/00 (2006.01); H01C 17/065 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01B 3/00 (2006.01); H01C 7/06 (2006.01); H05K 3/28 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H01C 7/003 (2013.01); H01B 3/004 (2013.01); H01C 7/06 (2013.01); H01C 17/06526 (2013.01); H01C 17/06566 (2013.01); H05K 1/167 (2013.01); H05K 1/181 (2013.01); H05K 3/282 (2013.01); H01C 17/06593 (2013.01); H05K 3/1216 (2013.01); H05K 3/288 (2013.01); H05K 2203/107 (2013.01);
Abstract
A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 μm or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.