The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Dec. 13, 2018
Applicant:

Sct Ltd., Grand Cayman, KY;

Inventors:

Shihfeng Shao, Milpitas, CA (US);

Chang Hung Pan, Milpitas, CA (US);

Heng Liu, Milpitas, CA (US);

Eric Li, Milpitas, CA (US);

Assignee:

SCT LTD., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); G09G 3/32 (2016.01); H01L 33/26 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H05K 1/02 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 33/26 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H05K 1/0274 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An LED display module contains a PCB, one or more layers of molding compound disposed on the surface of the PCB, a network of conductive tracks disposed on a surface of the one or more layer of molding compound away from the PCB, a plurality of through-holes extending through the one or more layers of molding compound, and an array of LED chips disposed in the one or more layers of molding compound. Each of electrodes on the LED chip is connected to one of the conductive pads via a conductive path. The conductive path comprises a conductive material inside one of the plurality of the through-holes and a portion of the network of conductive tracks.


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