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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10922260 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Oct. 06, 2017

Modular carrier form factors for computing platforms

Applicant:

Liqid Inc., Broomfield, CO (US);

Inventors:

Andrew Rudolph Heyd, Longmont, CO (US);

Brenden Michael Rust, Loveland, CO (US);

Jason Breakstone, Broomfield, CO (US);

Sumit Puri, Calabasas, CA (US);

Bryan Schramm, Broomfield, CO (US);

Assignee:

liqid inc., Broomfield, CO (US);

Attorney:
Primary Examiner:

Courtney L Smith

Assistant Examiner:

Rashen E Morrison

Int. Cl.
CPC ...
H05K 7/00 (2006.01); G06F 13/40 (2006.01); H05K 7/14 (2006.01); H04L 12/40 (2006.01); H04L 12/00 (2006.01); G06F 13/00 (2006.01); G06F 13/42 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4081 (2013.01); G06F 13/00 (2013.01); G06F 13/4022 (2013.01); G06F 13/4282 (2013.01); H04L 12/00 (2013.01); H04L 12/40013 (2013.01); H05K 1/028 (2013.01); H05K 1/11 (2013.01); H05K 7/14 (2013.01); G06F 2213/0026 (2013.01);
Abstract

Systems, methods, and software are disclosed herein having enhanced modular carrier form factors. In an implementation, a network card apparatus comprises a network card assembly. The network card assembly comprises a network interface card and a connector card coupled to the network interface card and comprising a U.2 connector configured to mate with a U.2 connector of the modular bay of the rackmount chassis assembly.

Find Patent Forward Citations

Quick Actions:

Heyd, Andrew. (2021). Modular carrier form factors for computing platforms (U.S. Patent No. 10922260). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10922260

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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