The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Apr. 10, 2018
Applicant:

Securaplane Technologies, Inc., Oro Valley, AZ (US);

Inventors:

Brandon Ross Mahoney, Phoenix, AZ (US);

Sarajin Ali, Alexandria, VA (US);

Dennis Keith Moxley, Dallas, GA (US);

Andrew Keith Dickerson, Chulota, FL (US);

Thomas David Black, Preston, GB;

Assignee:

SECURAPLANE TECHNOLOGIES, INC., Oro Valley, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01); G06F 1/16 (2006.01); H05K 5/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); G06F 1/182 (2013.01); H05K 5/0204 (2013.01); H05K 9/009 (2013.01); H05K 9/0047 (2013.01);
Abstract

A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.


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