The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Mar. 10, 2020
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yue Zhai, Beijing, CN;

Shouyang Leng, Beijing, CN;

Rui Han, Beijing, CN;

Zhipeng Zhang, Beijing, CN;

Zeyuan Tong, Beijing, CN;

Dong Cui, Beijing, CN;

Wenyang Li, Beijing, CN;

Zan Zhang, Beijing, CN;

Weining Chi, Beijing, CN;

Fengping Wang, Beijing, CN;

Rui Tan, Beijing, CN;

Qing Ma, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); G06F 1/16 (2006.01); B60K 35/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133308 (2013.01); B60K 35/00 (2013.01); G02F 1/133305 (2013.01); G06F 1/1609 (2013.01); B60K 2370/1523 (2019.05); B60K 2370/1533 (2019.05); G02F 2001/133314 (2013.01);
Abstract

The present application relates to the field of display technology and, in particular, to a display module and a display device. The display module comprises a backplane comprising a bottom plate and a side frame disposed on the bottom plate; a display assembly located in the side frame, the display assembly comprising a light source; a support member located on a side frame away from the bottom plate, where the support member is detachably connected to the side frame; and a cover plate located on the side of the support member facing away from the side frame, and the cover plate being bonded to the support member. This solution can solve the problem that the module is difficult to disassemble, so as to reduce the maintenance cost.


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