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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10921624 B1

PDFFull Text
Date of Patent:
Feb. 16, 2021

Filed:

Oct. 12, 2018

Display panel and method for manufacturing the same

Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Ordos Yuansheng Optoelectronics Co., Ltd., Inner Mongolia, CN;

Inventors:

Shicheng Sun, Beijing, CN;

Zhiqiang Wang, Beijing, CN;

Peirong Huo, Beijing, CN;

Jianfei Tian, Beijing, CN;

Delong Zhong, Beijing, CN;

Shuang Hu, Beijing, CN;

Assignees:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., Ordos, CN;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Edward J Glick

Assistant Examiner:

David Y Chung

Int. Cl.
CPC ...
G02F 1/133 (2006.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H01L 27/12 (2006.01); H01L 27/15 (2006.01); H01L 27/32 (2006.01); H01L 31/16 (2006.01); H03K 17/945 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13318 (2013.01); G02F 1/133512 (2013.01); G02F 1/133603 (2013.01); H01L 27/1218 (2013.01); H01L 27/1262 (2013.01); H01L 27/156 (2013.01); H01L 27/3227 (2013.01); H01L 27/3244 (2013.01); H01L 27/3272 (2013.01); H01L 31/165 (2013.01); H03K 17/945 (2013.01); H01L 2227/323 (2013.01);
Abstract

The present disclosure relates to a display panel and a method for manufacturing the same. The display panel includes an infrared receiver. The infrared receiver is disposed on a substrate and is located on one side of the substrate which is close to a light emitting surface, wherein the infrared receiver is configured to receive infrared light incident through the light emitting surface.

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