The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

May. 18, 2017
Applicant:

Arista Networks, Inc., Santa Clara, CA (US);

Inventors:

Youngbae Park, Santa Clara, CA (US);

Jiayi Wu, Santa Clara, CA (US);

Robert Wilcox, Santa Clara, CA (US);

Richard Hibbs, Santa Clara, CA (US);

Xin Xue, Santa Clara, CA (US);

Assignee:

Arista Networks, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4284 (2013.01); G02B 6/4269 (2013.01); G02B 6/428 (2013.01); H05K 7/20145 (2013.01); H05K 7/20163 (2013.01); H05K 7/20409 (2013.01); H05K 7/20418 (2013.01);
Abstract

An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.


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