The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
May. 30, 2019
Applicant:
Dura Operating, Llc, Auburn Hills, MI (US);
Inventor:
Indraneel Page, Farmington Hills, MI (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/08 (2006.01); G02F 1/13357 (2006.01); G06F 1/16 (2006.01); H01R 13/717 (2006.01); H01H 13/83 (2006.01); F21V 8/00 (2006.01); F21S 41/141 (2018.01); G06F 3/044 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
F21S 41/141 (2018.01); G06F 3/044 (2013.01); H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/58 (2013.01);
Abstract
An in-mold electronics package includes a printed circuit board (PCB) having a first side and a second side, the PCB defining an opening, a light emitting diode (LED) disposed on the second side adjacent the opening, a light guide disposed on the second side of the PCB and partially disposed within the opening, a film disposed on the first side of the PCB, and a cover disposed over the film, the cover connected to the light guide, and wherein the cover and the light guide cooperate to form at least one sealed perimeter wall of the in-mold electronics package.