The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
May. 20, 2016
Applicant:
Sabic Global Technologies B.v., Bergen Op Zoom, NL;
Inventors:
Kayoko Onda, Tochigi, JP;
Kazuhiko Mitsui, Tochigi, JP;
Assignee:
SABIC GLOBAL TECHNOLOGIES B.V., Bergen op Zoom, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 67/02 (2006.01); C08K 3/32 (2006.01); C08L 63/00 (2006.01); C08L 23/08 (2006.01); B60Q 1/04 (2006.01); B32B 1/04 (2006.01); B32B 27/36 (2006.01); B32B 15/09 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); C08L 67/03 (2006.01); C08K 5/00 (2006.01); F21S 41/30 (2018.01); F21S 41/37 (2018.01);
U.S. Cl.
CPC ...
C08L 67/02 (2013.01); B60Q 1/04 (2013.01); C08K 3/32 (2013.01); C08L 23/0884 (2013.01); C08L 63/00 (2013.01); B32B 15/09 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/40 (2013.01); B32B 2307/416 (2013.01); B32B 2307/71 (2013.01); B32B 2307/712 (2013.01); B32B 2307/714 (2013.01); B32B 2367/00 (2013.01); B32B 2457/00 (2013.01); B32B 2551/00 (2013.01); C08K 5/005 (2013.01); C08L 23/08 (2013.01); C08L 23/0846 (2013.01); C08L 23/0869 (2013.01); C08L 67/03 (2013.01); C08L 2201/08 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); F21S 41/30 (2018.01); F21S 41/37 (2018.01); Y10T 428/31681 (2015.04); Y10T 428/31786 (2015.04);
Abstract
A composition includes specific amounts of a poly(alkylene terephthalate) and an epoxy compound having a weight average molecular weight of at least (500) daltons, and an epoxy equivalent weight of at least (400) grams per equivalent. The composition exhibits high melt flow, and articles molded from the composition exhibit reduced high-temperature outgassing compared to corresponding compounds without the epoxy compound. The composition is suitable for molding directly metallizable reflectors and bezels for automotive headlights.