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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10920037 B1

PDFFull Text
Expired
Date of Patent:
Feb. 16, 2021

Filed:

Oct. 06, 2016

Thermally conductive polymer resin composition based on styrenics with low density

Applicant:

Ineos Styrolution Group Gmbh, Frankfurt am Main, DE;

Inventors:

Tobias Schulz, Cologne, DE;

Norbert Niessner, Friedelsheim, DE;

Gisbert Michels, Leverkusen, DE;

Hans-Werner Schmidt, Bayreuth, DE;

Tristan Kolb, Bayreuth, DE;

Assignee:

INEOS STYROLUTION GROUP GMBH, Frankfurt am Main, DE;

Attorney:

J.A. Lindeman & Co. PLLC

Primary Examiner:

Larry W Thrower

Int. Cl.
CPC ...
C08K 3/38 (2006.01); C08K 3/34 (2006.01); C08K 3/18 (2006.01); C08K 3/04 (2006.01); B29B 7/90 (2006.01); B29C 45/00 (2006.01); B29K 55/02 (2006.01); B29K 509/04 (2006.01);
U.S. Cl.
CPC ...
C08K 3/38 (2013.01); B29B 7/90 (2013.01); B29C 45/0001 (2013.01); B29C 45/0013 (2013.01); C08K 3/04 (2013.01); C08K 3/18 (2013.01); C08K 3/34 (2013.01); B29K 2055/02 (2013.01); B29K 2509/04 (2013.01); C08K 2003/385 (2013.01);
Abstract

Thermally conductive polymer (TCP) resin compositions are described, comprising components (X) and (Y): 90 to 99.9% component (X) comprising components (I) and (II): 60 to 85% matrix polymer (I) comprising styrenic polymers (F) selected from: ABS resins, ASA resins, and elastomeric block copolymers of the structure (S—(B/S))—S; 15 to 40% thermally conductive filler material (II) (D1 to 200 μηη), consisting of a ceramic material and/or graphite; 0.1 to 10% chemical foaming agent (Y). Shaped articles made thereof can be used for automotive applications, as a heat sink for high performance electronics, LED sockets or electrical and electronic housings.

Find Patent Forward Citations

Schulz, Tobias. (2021). Thermally conductive polymer resin composition based on styrenics with low density (U.S. Patent No. 10920037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10920037

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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