The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Aug. 27, 2018
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Akira Oota, Tokyo, JP;
Masahiro Ichino, Tokyo, JP;
Takuya Teranishi, Tokyo, JP;
Mitsuru Kutsuwada, Tokyo, JP;
Yusuke Watanabe, Yokkaichi, JP;
Natsumi Mukouzaka, Yokkaichi, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: