Polymer composition, molded part and processes for production thereof

Abstract

The present invention relates to a polymer composition, consisting of (A) 30-90 wt. % of at least one thermoplastic polymer comprising at least a semi-crystalline semi-aromatic polyamide (SSPA-1) in an amount in the range of 30-90 wt. %; (B) 10-70 wt. % of at least one reinforcing agent, and (C) 0-25 wt. % of one or more other components; wherein the SSPA-1 consists of (A-1-a) 90-100 wt. % of repeat units derived from (i) an aromatic dicarboxylic acid and (ii) diamines, and (A-1-b) 0-10 wt. % of repeat units derived from other monomers; the diamines (ii) consist of 80-95 mole % of a linear aliphatic diamine, 5-20 mole % of 2-methyl-pentamethylene diamine, and 0-10 mole % of other diamines; and the SSPA-1 has a melting temperature (Tm) of at least 300° C. The invention further relates to a molded part made of the composition, a process for making the composition and a process for making the molded part.