The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jul. 28, 2017
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Kan Fujihara, Otsu, JP;

Atsushi Kumasaki, Otsu, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08L 79/08 (2006.01); G03F 7/023 (2006.01); G03F 7/039 (2006.01); C08L 61/06 (2006.01); C08L 63/00 (2006.01); C08K 5/29 (2006.01); C08K 5/13 (2006.01); C08K 5/3445 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08G 73/106 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08K 5/13 (2013.01); C08K 5/29 (2013.01); C08K 5/3445 (2013.01); C08L 61/06 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); G03F 7/023 (2013.01); G03F 7/0236 (2013.01); G03F 7/039 (2013.01); H05K 3/28 (2013.01);
Abstract

A polyimide resin of the present invention contains a repeating unit represented by the formula (1). Xis a tetravalent organic group having at least one ring structure, and each two of four carbonyl groups bonded to Xform a pair and, together with Xand a nitrogen atom, form a five-membered ring. Ris a hydrogen, an alkyl group having 1-9 carbon atoms, or an alkoxy group having 1-10 carbon atoms. Y is a divalent organic group having a phenolic hydroxyl group. The polyimide resin of the present invention can be practically used as a thermosetting resin composition or a positive type photosensitive resin composition.


Find Patent Forward Citations

Loading…