The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jan. 25, 2019
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Yoshinao Yanagisawa, Minowa, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); G01P 15/125 (2006.01); G01L 1/14 (2006.01); G01P 1/02 (2006.01); G01P 15/08 (2006.01); H01L 23/055 (2006.01); G01P 15/18 (2013.01);
U.S. Cl.
CPC ...
B81C 1/0023 (2013.01); B81B 7/0048 (2013.01); G01L 1/144 (2013.01); G01P 1/023 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); G01P 15/18 (2013.01); H01L 23/04 (2013.01); H01L 23/055 (2013.01); H01L 24/49 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A physical quantity sensor includes a substrate, an acceleration sensor mounted on the substrate, an integrated circuit mounted on the substrate and stacked with the acceleration sensor, and serial communication wirings provided to the substrate. In a plan view of the acceleration sensor element, a bonding wire connecting the acceleration sensor element to the integrated circuit is disposed on an opposite side to the serial communication wirings with respect to a virtual central line of the acceleration sensor element.