The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10919390 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 16, 2021

Filed:

Sep. 20, 2017
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Taiki Moriizumi, Tochigi, JP;

Yuuki Kami, Tochigi, JP;

Noboru Hirano, Tochigi, JP;

Toshihiro Saimura, Tochigi, JP;

Hajime Miyamoto, Tochigi, JP;

Atsushi Yusa, Tochigi, JP;

Kazuhiro Kawano, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/16 (2006.01); B60K 37/00 (2006.01); B60R 21/2165 (2011.01); B29C 37/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B60K 37/00 (2013.01); B60R 21/2165 (2013.01); B29C 37/0057 (2013.01); B29C 45/1639 (2013.01); B29C 45/1657 (2013.01); B29L 2031/3038 (2013.01);
Abstract

An instrument panel () is formed by bonding a base material portion () composed of a base material Mand a different material portion () composed of a different material M. The different material portion () is infiltrated into the base material portion () and the infiltration portion () has a plurality of intermittent recessed portions.


Find Patent Forward Citations

Moriizumi, Taiki. (2021). Resin component, and molding method and molding device for same (U.S. Patent No. 10919390). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10919390

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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