The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Mar. 17, 2017
Lockheed Martin Corporation, Bethesda, MD (US);
Randall Mark Stoltenberg, Palo Alto, CA (US);
Alfred A. Zinn, Palo Alto, CA (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal.