The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jun. 10, 2020
Applicant:

Coretech System Co., Ltd., Chupei, TW;

Inventors:

Huan-Chang Tseng, Chupei, TW;

Rong-Yeu Chang, Chupei, TW;

Chia-Hsiang Hsu, Chupei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); B29C 45/77 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7693 (2013.01); B29C 45/766 (2013.01); B29C 45/77 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/76187 (2013.01); B29C 2945/76257 (2013.01); B29C 2945/76545 (2013.01); B29K 2995/0044 (2013.01); G05B 2219/45244 (2013.01);
Abstract

The present disclosure provides a molding system for preparing injection-molded articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the anisotropic viscosity distribution of the molding resin is generated based in part on an elastic effect of the molding resin; and a controller operably communicating with the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.


Find Patent Forward Citations

Loading…