The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jan. 28, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Venkat Hariharan, Lehi, UT (US);

Rajeev Bajaj, Fremont, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 49/10 (2006.01); B24B 49/16 (2006.01); B24B 37/26 (2012.01); B24B 37/22 (2012.01); B29C 64/112 (2017.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/005 (2013.01); B24B 37/04 (2013.01); B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24B 49/10 (2013.01); B24B 49/16 (2013.01); B29C 64/112 (2017.08); C09G 1/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01);
Abstract

Embodiments described herein relate to methods of detecting a polishing endpoint using one or more sensors embedded in the polishing material of a polishing pad, the polishing pads, and methods of forming the polishing pads. In one embodiment, a method of polishing a substrate includes urging a to be polished surface of a substrate against a polishing surface of a polishing pad, the polishing pad having one or more sensors embedded in the polishing pad material thereof, wherein the polishing pad is mounted on a polishing platen of a polishing system, detecting a force exerted against a polishing surface of the polishing pad using the one or more sensors, converting the detected force into signal information, wirelessly communicating the signal information received from the one or more sensors to one or more interrogators disposed in the polishing platen, and changing one or more polishing conditions based on the signal information.


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