The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Nov. 04, 2016
Applicant:

Sumitomo Wiring Systems, Ltd., Mie, JP;

Inventors:

Osamu Satou, Mie, JP;

Jiguo Zheng, Mie, JP;

Masamichi Yamagiwa, Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 5/01 (2006.01); H01R 43/048 (2006.01); B21F 15/08 (2006.01); H01R 4/18 (2006.01); B21D 53/00 (2006.01); B21F 15/04 (2006.01); B21C 37/06 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
B21D 5/015 (2013.01); B21C 37/06 (2013.01); B21D 53/00 (2013.01); B21F 15/04 (2013.01); B21F 15/08 (2013.01); H01R 4/18 (2013.01); H01R 43/0207 (2013.01); H01R 43/048 (2013.01);
Abstract

The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces. A bonding process portion of a band-shaped metal wire member is folded in two and arranged within the depression.


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