The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jul. 31, 2018
Applicant:
Olympus Corporation, Hachioji, JP;
Inventors:
Tetsuya Endo, Tokyo, JP;
Naohito Shiga, Tokyo, JP;
Kohei Shiramizu, Kawasaki, JP;
Junko Nakamoto, Osaka, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); B32B 15/08 (2006.01); H01R 13/405 (2006.01); B29C 45/14 (2006.01); A61L 29/10 (2006.01); A61B 18/14 (2006.01); A61L 29/02 (2006.01); A61L 29/06 (2006.01); C08J 5/18 (2006.01); H01R 13/03 (2006.01); H01R 13/52 (2006.01); B29K 705/00 (2006.01); A61B 18/00 (2006.01); B29K 71/00 (2006.01); B29K 705/14 (2006.01); B29L 31/00 (2006.01); B32B 1/00 (2006.01);
U.S. Cl.
CPC ...
A61B 1/00124 (2013.01); A61B 1/0011 (2013.01); A61B 1/00078 (2013.01); A61B 1/00128 (2013.01); A61B 18/1482 (2013.01); A61L 29/02 (2013.01); A61L 29/06 (2013.01); A61L 29/106 (2013.01); B29C 45/14 (2013.01); B29C 45/14811 (2013.01); B32B 15/08 (2013.01); C08J 5/18 (2013.01); H01R 13/03 (2013.01); H01R 13/405 (2013.01); H01R 13/521 (2013.01); H01R 13/5216 (2013.01); A61B 2018/00148 (2013.01); A61B 2018/00178 (2013.01); A61B 2018/00601 (2013.01); A61L 2420/06 (2013.01); A61L 2420/08 (2013.01); B29C 2045/14868 (2013.01); B29K 2071/00 (2013.01); B29K 2705/00 (2013.01); B29K 2705/14 (2013.01); B29L 2031/7546 (2013.01); B32B 1/00 (2013.01); B32B 2535/00 (2013.01); C08J 2371/10 (2013.01); H01R 13/5224 (2013.01); H01R 2201/12 (2013.01);
Abstract
An insert molded product in which a metal base member and a resin are bonded together includes a ground layer; a noble metal layer formed of a noble metal; a compound layer formed of a compound containing silicon (Si) and oxygen (O); and a mixture layer where the compound and the resin are mixed together, wherein the ground layer, the noble metal layer, the compound layer, and the mixture layer are formed in this order on the metal base member, and wherein nickel (Ni) is included in both the compound layer and the mixture layer.