The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Oct. 15, 2013
Applicant:
Tdk Corporation, Tokyo, JP;
Inventor:
Kazutoshi Tsuyutani, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/115 (2013.01); H05K 3/30 (2013.01); H05K 3/42 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/15313 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/49146 (2015.01);
Abstract
Disclosed herein is a circuit board that includes a resin substrate including a substrate wiring layer, and an electronic component embedded in the resin substrate and having a plurality of external electrodes. The resin substrate includes a plurality of via holes that expose the external electrodes and a plurality of via conductors embedded in the via holes to electrically connect the substrate wiring layer to the external electrodes. At least some of the via holes are different in planar shape from each other.