The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Jan. 11, 2019
Applicant:
Corning Incorporated, Corning, NY (US);
Inventor:
Shrisudersan Jayaraman, Horseheads, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01); H05K 3/16 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 21/486 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/16 (2013.01); H05K 3/388 (2013.01); H05K 3/423 (2013.01);
Abstract
An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.