The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Jul. 09, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Norikazu Motohashi, Tokyo, JP;

Shinji Nishizono, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01); H05K 7/20 (2006.01); H02K 11/33 (2016.01); H02K 11/40 (2016.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H02K 11/33 (2016.01); H02K 11/40 (2016.01); H05K 5/006 (2013.01); H05K 5/04 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H02K 2211/03 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10409 (2013.01);
Abstract

The reliability of an electronic device is improved. An electronic device has a wiring substrate and a housing made of a metal for supporting the wiring substrate. A semiconductor device having a switching power transistor is mounted at the wiring substrate. A ground pattern of a conductive film and a heat radiation pattern of a conductive film are formed at the wiring substrate. The heat radiation pattern is not electrically coupled with any electronic component mounted at the wiring substrate, and is also not electrically coupled with the ground pattern. The ground pattern overlaps the semiconductor device in the thickness direction of the wiring substrate. The heat radiation pattern overlaps the ground pattern in the thickness direction of the wiring substrate, and overlaps a region where the housing and the wiring substrate are in contact with each other.


Find Patent Forward Citations

Motohashi, Norikazu. (2021). Electronic device (U.S. Patent No. 10917962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10917962

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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