The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Dec. 08, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Yasunori Tsukuda, Kanagawa, JP;
Kenichi Takamiya, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H04N 5/379 (2018.08); H01L 24/00 (2013.01); H01L 25/167 (2013.01); H01L 27/14612 (2013.01); H01L 27/14634 (2013.01); H01L 27/14643 (2013.01); H04N 5/378 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 27/14609 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81895 (2013.01);
Abstract
An imaging device comprising a pixel substrate including pixel element circuitry, a logic substrate including read circuitry configured to receive an output signal voltage from the pixel element circuitry, and electrically-conductive material arranged between the pixel substrate and the logic substrate, wherein the electrically-conductive material is configured to transfer at least one reference voltage from the logic substrate to the pixel substrate, wherein the electrically-conductive material comprises a Cu—Cu bonding portion.