The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 28, 2017
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Yuta Momiuchi, Kanagawa, JP;

Ryo Itotani, Kanagawa, JP;

Hirokazu Nakayama, Kanagawa, JP;

Tooru Kai, Oita, JP;

Miyoshi Togawa, Oita, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/22521 (2018.08);
Abstract

To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.


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