The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Jul. 06, 2020
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventors:

Matthew C. Sesti, Williamston, MI (US);

Robert A. Devota, Durand, MI (US);

Yuesheng Lu, Farmington Hills, MI (US);

Steven V. Byrne, Goodrich, MI (US);

Joel S. Gibson, Linden, MI (US);

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G02B 7/02 (2006.01); G02B 7/04 (2006.01); G02B 13/00 (2006.01); G02B 27/00 (2006.01); H01L 27/146 (2006.01); H04N 5/232 (2006.01); B60R 11/04 (2006.01); G02B 27/62 (2006.01); G02B 7/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); B60R 11/04 (2013.01); G02B 7/003 (2013.01); G02B 7/02 (2013.01); G02B 7/025 (2013.01); G02B 7/04 (2013.01); G02B 13/001 (2013.01); G02B 27/0025 (2013.01); G02B 27/62 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H04N 5/23293 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A method of providing a camera sub-assembly for a vehicular camera includes providing a lens barrel, a lens holder and a printed circuit board, and dispensing an adhesive in an uncured state at one or both of (i) an annular attaching surface at an outer end of a receiving structure of the lens holder and (ii) an annular attaching surface of an annular flange of the lens barrel. With the adhesive contacting both of the annular attaching surfaces, the lens optics are aligned with respect to the imaging array at the printed circuit board by utilizing a multi-axis positioning device. After aligning the lens optics with respect to the imaging array, the adhesive is cured to a first cure level and the lens barrel and the lens holder joined together by the adhesive are moved to a further curing station, where the adhesive is further cured to a second cure level.


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