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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10917069 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Sep. 12, 2017

Electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Takashi Iwamoto, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Bryan P Gordon

Int. Cl.
CPC ...
H03H 9/02 (2006.01); H01L 23/04 (2006.01); H01L 23/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H01L 23/31 (2006.01); H03H 9/25 (2006.01); H01L 23/10 (2006.01); H03H 3/02 (2006.01); H03H 9/09 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02133 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/3128 (2013.01); H03H 3/02 (2013.01); H03H 9/059 (2013.01); H03H 9/0542 (2013.01); H03H 9/0547 (2013.01); H03H 9/09 (2013.01); H03H 9/1014 (2013.01); H03H 9/1057 (2013.01); H03H 9/1071 (2013.01); H03H 9/1085 (2013.01); H03H 9/25 (2013.01); H01L 21/568 (2013.01); H01L 23/562 (2013.01);
Abstract

An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

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