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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10917062 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Dec. 20, 2018

Method of manufacturing electronic component and electronic component

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yoshinori Sato, Tokyo, JP;

Shigeyuki Doi, Tokyo, JP;

Takeo Ougimoto, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Rakesh B Patel

Int. Cl.
CPC ...
H03H 1/00 (2006.01); H03H 3/00 (2006.01); H03H 7/01 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01F 17/00 (2006.01); H01G 4/008 (2006.01); H01G 4/38 (2006.01); H01F 41/04 (2006.01); H01G 4/40 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H03H 1/00 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01F 41/043 (2013.01); H01G 4/0085 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H03H 3/00 (2013.01); H01F 2017/008 (2013.01); H01F 2017/0026 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01); H03H 7/0115 (2013.01); H03H 7/1758 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A method of manufacturing an electronic component includes: preparing an element body configured to have a rectangular parallelepiped shape and include a first surface serving as a mounting surface, a second surface opposing the first surface, and a third surface extending in such a way as to connect the first surface and the second surface; forming a chamfered portion chamfered between the first surface and the third surface; forming a terminal electrode on the first surface; covering the chamfered portion and the first surface with a covering member; forming a metal shield film on a part of the element body, the part including at least the second surface and the third surface and exposed from the covering member; and removing the covering member.

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