The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 21, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Toshiyuki Nakaiso, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 9/04 (2006.01); H01F 17/00 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01); H03H 7/01 (2006.01); H01F 27/29 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H02H 9/045 (2013.01); H01F 17/0013 (2013.01); H01L 27/0248 (2013.01); H01L 28/60 (2013.01); H02H 9/04 (2013.01); H03H 7/0115 (2013.01); H01F 27/292 (2013.01); H01F 2017/0026 (2013.01); H01L 25/16 (2013.01);
Abstract

An ESD-protective surface-mount composite component that includes a surface-mount inductor and a thin-film component. The surface-mount inductor includes a body, a first outer conductor and a second outer conductor individually formed at both ends of the body in a first direction, and a third outer conductor formed at an intermediate position of the body in the first direction. The thin-film component includes a flat plate-like body, an ESD protection element formed inside the body, a first terminal conductor connected to the ESD protection element and formed on a front surface of the body, and a second terminal conductor connected to the ESD protection element and formed on the front surface of the body. The first terminal conductor is joined to the first outer conductor, and the second terminal conductor is joined to the third outer conductor.


Find Patent Forward Citations

Loading…