The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Aug. 18, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Seiji Kiyota, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); F21K 9/64 (2016.01); H01S 5/02212 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02296 (2013.01); F21K 9/64 (2016.08); H01S 5/02212 (2013.01); H01S 5/02288 (2013.01);
Abstract

A method of manufacturing a light emitting device includes: providing a first support member having an outer circumferential lateral surface and a first through-hole penetrating from an upper surface to a lower surface; disposing a light-transmissive member containing a fluorescent material in the first through-hole; providing a second support member having an inner circumferential lateral surface and a second through-hole penetrating from an upper surface to a lower surface, an inner dimension of the second support member being smaller than an outer dimension of the first support member at room temperature; and performing shrink fitting, which comprises heating the first support member and the second support member to increase the inner dimension of the second support member to be greater than the outer dimension of the first support member, thereafter disposing the first support member in the second support member.


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