The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Nov. 19, 2019
Applicant:

Mellanox Technologies, Ltd., Yokneam, IL;

Inventors:

Nimer Khazen, Baena, IL;

Jamal Mousa, Haifa, IL;

Dor Oz, Tel Aviv, IL;

David Fischer, Tel Aviv, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/646 (2011.01); H01R 13/50 (2006.01); H01R 13/66 (2006.01); H01R 43/20 (2006.01); H01R 13/56 (2006.01); H05K 3/32 (2006.01); H01R 24/60 (2011.01); H01R 13/6589 (2011.01); H05K 1/11 (2006.01); H01R 12/53 (2011.01); H01R 13/6594 (2011.01);
U.S. Cl.
CPC ...
H01R 13/50 (2013.01); H01R 13/562 (2013.01); H01R 13/646 (2013.01); H01R 13/665 (2013.01); H01R 43/205 (2013.01); H01R 12/53 (2013.01); H01R 13/6589 (2013.01); H01R 13/6594 (2013.01); H01R 24/60 (2013.01); H05K 1/117 (2013.01); H05K 3/325 (2013.01);
Abstract

A connector backshell for accommodating and protecting rows of twisted pairs of cables is provided. The backshell includes four sidewalls and a printed circuit board (PCB) with a first group of conductive pads printed on the top side of the PCB and located at the rear side of the PCB, for receiving rows of corresponding wires of insulated cables, to be connected to the conductive pads, such that one row is located below the PCB and the other rows are located on top of each other above the top surface of the PCB. A second group of conductive pads are printed on the bottom side of the PCB and located at the rear side of the PCB, for receiving corresponding wires of insulated cables, to be connected to the conductive pads, such that at least one row is located below the PCB.


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