The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 21, 2018
Applicant:

Fujitsu Component Limited, Tokyo, JP;

Inventors:

Kimihiro Maruyama, Tokyo, JP;

Masakazu Muranaga, Tokyo, JP;

Masaru Sakurai, Tokyo, JP;

Tatsuya Kakehashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 1/12 (2006.01); H01Q 1/42 (2006.01); H01Q 21/06 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/12 (2013.01); H01Q 1/42 (2013.01); H01Q 1/526 (2013.01); H01Q 9/0407 (2013.01); H01Q 21/065 (2013.01);
Abstract

A wireless module including: a substrate that includes a first surface and a second surface on the back side of the first surface; a plurality of signal terminals that are provided on the first surface and the second surface, input and output signals; an antenna provided on the first surface; a signal processing circuit that is provided on the second surface, is connected between the signal terminals and the antenna, and performs various signal processings on signals input from the signal terminals and the antenna; wherein the signal terminals are arranged in horizontal symmetry on the first surface and the second surface, arranged at the same positions of the first surface and the second surface, and connected to a single signal line in the substrate.


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