The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Nov. 19, 2018
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Hubei, CN;

Inventor:

Yan Xie, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3258 (2013.01); H01L 27/3246 (2013.01); H01L 27/3262 (2013.01); H01L 27/3265 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1255 (2013.01); H01L 27/1274 (2013.01); H01L 29/66757 (2013.01); H01L 29/78675 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01);
Abstract

An array substrate and a method of manufacturing the same are provided. The array substrate sequentially includes a flexible substrate, a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an inter-insulating layer, a first organic filling layer, a source-drain wiring layer, a planarization layer, an anode layer, a pixel defining layer, and a supporting layer from bottom to top; the first organic filling layer is convex upward on the inter-insulating layer, making the source-drain wiring layer covering thereon disposed to be convex. The method of manufacturing the array, substrate is sequentially to manufacture the layers from bottom to top, wherein the convex first organic filling layer disposed on the inter-insulating layer of the array substrate is used to raise a drain thereon.


Find Patent Forward Citations

Loading…