The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Jun. 07, 2017
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Martin Newman, Saratoga, CA (US);

Sagheer Ahmad, Cupertino, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06F 3/06 (2006.01); G06F 12/0802 (2016.01); G06F 13/16 (2006.01); G06F 13/20 (2006.01); H04L 12/933 (2013.01); G11C 5/06 (2006.01); G11C 8/18 (2006.01); G06F 13/42 (2006.01); G06F 13/40 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/04 (2013.01); G06F 3/0631 (2013.01); G06F 12/0802 (2013.01); G06F 13/1689 (2013.01); G06F 13/20 (2013.01); G06F 13/4095 (2013.01); G06F 13/4234 (2013.01); G11C 5/06 (2013.01); G11C 5/063 (2013.01); G11C 8/18 (2013.01); H01L 23/5381 (2013.01); H01L 24/07 (2013.01); H01L 24/14 (2013.01); H01L 24/15 (2013.01); H04L 49/103 (2013.01); H04L 49/15 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05075 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to a qualified stacked silicon interconnect (SSI) technology programmable integrated circuit (IC) region by providing an interface (e.g., an HBM buffer region implemented with a hierarchical switch network) between the added feature device and the programmable IC region. One example apparatus generally includes a programmable IC region and an interface region configured to couple the programmable IC region to at least one fixed feature die via a first plurality of ports associated with the at least one fixed feature die and a second plurality of ports associated with the programmable IC region. The interface region is configured as a switch network between the first plurality of ports and the second plurality of ports, and the switch network includes a plurality of full crossbar switch networks.


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