The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Jul. 26, 2019
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/8234 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 21/823443 (2013.01); H01L 21/823475 (2013.01); H01L 27/0617 (2013.01);
Abstract
Reliability of a semiconductor device is improved. The semiconductor device includes a silicon pattern for a fuse element, a metal silicide layer formed on an upper surface and a side surface of the silicon pattern, a gate electrode for MISFET, and a metal silicide layer formed on an upper surface of the gate electrode. The height from the lower surface of the silicon pattern to the lower end of the metal silicide layer is lower than the height from the lower surface of the gate electrode to the lower end of the metal silicide layer.