The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 21, 2018
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Yoshihiro Yasuda, Matsumoto, JP;

Takayuki Shimatou, Matsumoto, JP;

Kenpei Nakamura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 24/49 (2013.01); H01L 23/49548 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01);
Abstract

Provided is a semiconductor device including a semiconductor chip; a frame member having a chip placement surface on which the semiconductor chip is provided; and a first suspension lead and a second suspension lead connected to the frame member and provided on any side of the frame member, wherein M1≤L1+L2 is satisfied, where L1 is a distance from an arrangement position of the first suspension lead to a corner of the chip placement surface close to the first suspension lead, L2 is a distance from an arrangement position of the second suspension lead to a corner of the chip placement surface close to the second suspension lead, and M1 is a distance from the arrangement position of the first suspension lead to the arrangement position of the second suspension lead.


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